Spectrum spaghetti means TDD is the more suitable technology
Chip allies pledge production breakthrough
February 10, 2012
IBM and Samsung are gearing up to unveil fresh innovations in chipsets that could drive the next round of development in mobile phones.
The pair has teamed with Global Foundries and 20 other chip making firms to form the Common Platform Technology Forum, and plan to discuss the latest developments in chip production at a dedicated event in March. Topics on the table include 28-, 20- and 14-nanometer production processes, along with future wafer manufacturing methods.
Forum partners power most of today’s leading mobile handsets and other consumer electronics, an IBM statement reveals. Michael Cadigan, general manager of the firm’s microelectronics division, says the combined expertise of the forum’s partners will drive “breakthrough technology innovations for semiconductor manufacturing.”