Huawei unveils mobile devices

Melissa Chua
16 Feb 2011

Huawei has launched its latest smartphone, the Android Gngerbread-based IDEOS X3.

The device features a 3.2 inch capacitive HVGA touchscreen, 3 megapixel camera and an over-the-air firmware upgrade feature. The device’s hardware specifications may not be top of the line, but Huawei claims the IDEOS X3 is the thinnest device in the 3.2-inch screen market.

The IDEOS X3 comes equipped with software geared towards social media communication and will be available in Japan through operator Softbank from spring this year.

The Chinese vendor also unveiled its S7 Slim tablet, a seven inch capacitive touchscreen device running Qualcomm’s Snapdragon processor.

The device is a tad slimmer than its S7 predecessor, and features USB, HDMI and microSD slots. The aluminium-clad device is expected to come packaged with Android 2.2.

Also unveiled at the Mobile World Congress was the Huawei HiLink, a plug-and-link data high-speed Internet card and the Huawei Mobile Wifi Smart Pro wireless modem.


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