Texas Instruments' new ultra-thin module allows for better graphics design for contactless smartcards.
TI said its new module is 26 percent thinner than conventional packaged contactless chip offerings.
Using this new module, card manufacturers can create thinner PVC pre-laminate sheets for the contactless layer.
The 280um (11mil) ultra-thin module enables the creation of pre-laminates as thin as 345um (13.6 mil), according to TI.
This allows the card manufacturers to print the card's colorful artwork on thicker print stock while maintaining the 680-840um (26.8-33.1 mil) ISO standard for card thickness.
Thicker print stock makes these complex cards more durable and able to survive multiple passes through a printing press during standard card manufacturing processes.