The Hybrid Memory Cube Consortium (HMCC), led by Micron Technology and Samsung Electronics announced that Microsoft has joined the industry group.
The HMCC is a collaboration of original equipment manufacturers (OEMs), enablers and integrators who are cooperating to develop and implement an open interface standard for an innovative new memory technology called the Hybrid Memory Cube (HMC).
Micron and Samsung, the initial developing members of the HMCC, are working closely with Altera, IBM, Open-Silicon, Xilinx and now Microsoft to accelerate widespread industry adoption of HMC technology.
The technology will enable highly efficient memory solutions for applications ranging from industrial products to high-performance computing and large-scale networking. The HMCC's team of developers plans to deliver a draft interface specification to a growing number of “adopters” that are joining the consortium. Then, the combined team of developers and adopters will refine the draft and release a final interface specification at the end of this year.
Adopter membership in the HMCC is available to any company interested in joining the consortium and participating in the specification development. The HMCC has responded to interest from more than 75 prospective adopters.