Fujitsu's new mobile Wimax chipsets features low power and small form factor optimized for handheld devices such as smartphones and PDAs.
The chipset includes a baseband LSI, an RF LSI and a power management LSI.
The chipset was designed so that the size of the Wimax module will be 12x12mm. The standby current - which has a direct impact on battery life - will not exceed 0.5mA, according to Fujitsu.
Fujitsu said it will start shipping samples of its chipset by August.