Low power chipset for mobile Wimax devices

25 Jun 2008

Fujitsu's new mobile Wimax chipsets features low power and small form factor optimized for handheld devices such as smartphones and PDAs.

The chipset includes a baseband LSI, an RF LSI and a power management LSI.

The chipset was designed so that the size of the Wimax module will be 12x12mm. The standby current - which has a direct impact on battery life - will not exceed 0.5mA, according to Fujitsu.

Fujitsu said it will start shipping samples of its chipset by August.

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